1. Chip component: place_ On the basis of the maximum peripheral size of the bound layer device (whichever is greater in pad and screen printing), the single side is about 0.2mm larger.
2. Sop type devices: place_ The bound layer has two sides with pins that are 1.35mm larger than the maximum peripheral size of the device on one side, and the side without pins that is 1.5mm larger than the maximum peripheral size on one side.
3. Qfp device: place_ The bound layer is 1.35mm larger than the maximum peripheral size of the device around it.
4. BGA device: place_ The bound layer is 5.0mm larger than the maximum peripheral size of the device around it.
5. Insert device: place_ The boundary layer is 0.5mm larger than the maximum peripheral size of the device.
6. Connector: Vertical mounted devices have a length of 5.0mm on each side, while for curved mounted devices, the length facing away from the board edge can be 5.0mm, and the board edge can be 0.
7. Other types of devices are divided into plug-in and mount: Insert in Place_ BOUND_ The size of the TOP layer is an additional 0.5mm on one side based on the maximum peripheral size of the device (whichever is greater in pad and screen printing), while for mounting, an additional 0.3mm is added on one side based on the maximum peripheral size.